Our results imply that persistence of chronic pain is predetermined by corticolimbic neuroanatomical factors. Opioid gene polymorphisms and negative mood contributed indirectly through corticolimbic anatomical factors, to risk for chronic pain. Higher incidence of white matter and functional connections within the dorsal medial prefrontal cortex–amygdala–accumbens circuit, as well as smaller amygdala volume, represented independent risk factors, together accounting for 60% of the variance for pain persistence. Intra-corticolimbic white matter connectivity analysis identified three segregated communities: dorsal medial prefrontal cortex–amygdala–accumbens, ventral medial prefrontal cortex–amygdala, and orbitofrontal cortex–amygdala–hippocampus. Whole-brain comparisons indicated corticolimbic, but not pain-related circuitry, white matter connections predisposed patients to chronic pain. We tracked brain properties in subacute back pain patients longitudinally for 3 years as they either recovered from or transitioned to chronic pain. Mechanisms of chronic pain remain poorly understood.
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See Tracey (doi:10.1093/brain/aww147) for a scientific commentary on this article. Vachon-Presseau, Etienne Tétreault, Pascal Petre, Bogdan Huang, Lejian Berger, Sara E. Multi-layer assemblies with predetermined stress profile and method for producing sameĬorticolimbic anatomical characteristics predetermine risk for chronic pain Selective production of overall bending moments in microstructures enables manufacture of such structures with a wide array of geometrical configurations. Multi-layer assemblies exhibiting selectively determinable overall bending moments are also disclosed. The thin films forming the multi-layer assemblies may be disposed immediately adjacent to one another without the use of intermediate layers between the thin films. The multi-layer assemblies comprise at least one constituent thin film having a tensile stress and at least one constituent thin film having a compressive stress. In particular, a multi-layer assembly of polysilicon thin films may be produced that has a stress level of zero, or substantially so. Multi-layer assemblies of polysilicon thin films having predetermined stress characteristics and techniques for forming such assemblies are disclosed. (Inventor) Kahn, Harold (Inventor) Yang, Jie (Inventor) Phillips, Stephen M.
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Large area polysilicon films with predetermined stress characteristics and method for producing same